Structure & operating principle
Shapes of the HP
Heat Pipe Heat Sink (1)
Heat Pipe Heat Sink (2)
HPHX for heat recovery
HPHX for cooling enclosure
Flat plate HP
HPHS Cooling device
Liquid cold plate
Heat sink
Drawings of HS & HPHS
 




1. Main power device stack for the Korea high- speed railway
  using Heat Pipe Heat Sink
2. Main power conversion equipment for the Korean high-
  speed railway using Heat Pipe Heat Sink 


The Heat Pipe Heat Sink (HPHS) which consists of a block, heat pipes and fins is a device designed for cooling power semiconductors such as GTO thyristor, IGCT, IGBT, etc. It is capable of transferring a large amount of heat from a power semiconductor mounted on the heat sink block to fins attached at the heat pipe condenser. The transferred heat is dissipated to the surrounding air by natural or forced convection. For cooling the power semiconductors (which are used in the converter and the inverter of the power control for electric railway and subway), they are placed on the surface of the heat sink blocks. Several HPHSs are utilized for cooling power semiconductors.



Advantages:

high cooling capacity. long term high reliability. electrical safety due to separation of heat source from radiating section. no power in operation. easy maintenance.