Structure & operating principle
Shapes of the HP
Heat Pipe Heat Sink (1)
Heat Pipe Heat Sink (2)
HPHX for heat recovery
HPHX for cooling enclosure
Flat plate HP
HPHS Cooling device
Liquid cold plate
Heat sink
Drawings of HS & HPHS








 




1. Forced convection for type GTO thyristor:
  Electrical insulation with the ceramic tube, Dielectric working fluid
2. Forced convection for type IGCT:
  Electrical insulation with the ceramic tube, Dielectric working fluid
3. Natural convection type for IGBT module


Electrical insulation is necessary for GTO thyristor and IGCT. The heat block is insulated from the radiating section using the ceramic tube, and also the dielectric working fluid is used. The shape of the Heat Pipe Heat Sink can be changed according to the installation conditions and types of semiconductor. Various cooling methods such as natural or forced convection can be applied. For the forced convection, the system size can be reduced as the air velocity increases.


Applications:

DC motor control (DC chopper). AC motor control (VVVF inverter, converter). DC stabilization electric source (DC-DC chopper). AC stabilization electric source (CVCF inverter). Rectifier, etc.