Structure & operating principle
Shapes of the HP
Heat Pipe Heat Sink (1)
Heat Pipe Heat Sink (2)
HPHX for heat recovery
HPHX for cooling enclosure
Flat plate HP
HPHS Cooling device
Liquid cold plate
Heat sink
Drawings of HS & HPHS


1. Temperature change as a function of time after wafer loading
2. Temperature map on the wafer surface at the steady state


8 inch hot plate using the flat plate heat pipe

The heat pipe hot plate is a device to heat the plate surface uniformly. This heat pipe is using an isothermal characteristic
during phase change. The internal structure of flat plate heat pipe consists of several compartments separated by isolated islands.
This is to get an isothermal and uniform temperature distribution
of wafer surface in the semiconductor manufacturing processes. The semiconductor yield can be highly improved since the wafer surface heated from the upper plate has a uniform temperature distribution.